Multi-electron beam exposure method and apparatus
US7126140B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 30, 2005 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Aug 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31767
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A multi-electron beam exposure method and apparatus, wherein electron beams are applied to a sample surface mounted on a traveling sample stage to perform repeated exposure of chip patterns. An exposure region of the sample surface is partitioned into multiple stripe regions having a width in an x-axis direction, and each of the multiple stripe regions is further partitioned into multiple main fields having a width in a y-axis direction. At least one of the widths of the main fields in the x- and y-axis directions is set to a value, and exposure pattern data for one chip based on the partitioned main fields is stored as a unit. The stored exposure pattern data is readout a number of times corresponding to the number of chips repeatedly, and each electron beam provides repeated exposure of same regions of the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.