Leveler compounds
US7128822B2 · kind B2 · utility
31Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2003 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.