Probe card assembly
US7129730B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 15, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.