Helical microelectronic contact and method for fabricating same
US7131848B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2005 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Sep 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.