Method and system for depositing material on a substrate using a solid precursor
US7132128B2 · kind B2 · utility
13Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method is disclosed for vaporizing a solid precursor and transporting the precursor vapor to a process chamber. The film precursor vaporization system is coupled to the process chamber and positioned directly above the substrate. A precursor valve system within the film precursor vaporization system permits closing off the flow of precursor vapor to the process chamber while carrier gas flows through or over the film precursor, and once the carrier gas is saturated with precursor vapor, the precursor valve system is opened to permit the flow of precursor vapor to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.