Monitoring signals between two integrated circuit devices within a single package
US7133798B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Oct 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48137
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a method is provided for monitoring signals communicated between a first integrated circuit chip and a second integrated circuit chip within a single packaged semiconductor device, wherein at least some external terminals for the packaged semiconductor device are shared by the first and second integrated circuit chips. The method includes the following: receiving signals from the first integrated circuit chip at a plurality of bond pads on the second integrated circuit chip; selecting a portion of the received signals; and outputting the selected portion of the received signals from the single packaged semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.