Wafer level global bitmap characterization in integrated circuit technology development

US7137085B1 · kind B1 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• John Jianshi Wang · San Jose, US
• Siu May Ho · Sunnyvale, US
• Jeffrey P. Erhardt · San Jose, US
• Srikanth Sundararajan · Cambridge, US
• David C. Newbury · Saratoga, US
• Shivananda Shetty · Sunnyvale, US
• Paul J. Steffan · Elk Grove, US
• Franklyn Shihyu Wu · San Francisco, US

Key dates

• Filing date: Jun 1, 2004
• Grant date: Nov 14, 2006
• Expiry date: Nov 25, 2024

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/318511
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system and method for wafer level global bitmap characterization include determining chip level defect data bitmaps from a semiconductor wafer, and consolidating the chip level defect data bitmaps into a global wafer level bitmap that characterizes substantially the entire wafer failure configuration. The global wafer level bitmap is then analyzed and compared with other global wafer level bitmaps to develop correlations thereamong and develop global wafer level bitmap definitions for conducting at least one of wafer-to-wafer, boat-to-boat, and lot-to-lot process analysis based upon the global wafer level bitmap definitions.