Miniaturized contact spring
US7137830B2 · kind B2 · utility
7Cited by
15References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Mar 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4092
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.