Method for fabricating anisotropic conductive substrate
US7140101B2 · kind B2 · utility
3Cited by
4References
10Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Nov 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 μm and 250 μm. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.