Method to prevent damage to probe card
US7143500B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses, and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.