Method and apparatus to enable accurate wafer prediction
US7144297B2 · kind B2 · utility
20Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2005 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | May 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B23/0297
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method for monitoring a processing tool in a semiconductor manufacturing facility includes selecting key hardware parameters for a virtual sensor system based on manufacturing data associated with a fabrication tool and collecting manufacturing data associated with the fabrication tool. The method further includes dynamically maintaining the virtual sensor system during the manufacture of a plurality of semiconductor products and using the virtual sensor system and the collected manufacturing data for predicting a condition of a semiconductor product after being processed by the fabrication tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.