Semiconductor device having solder bumps reliably reflow solderable
US7145236B2 · kind B2 · utility
42Cited by
15References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.