Optic semiconductor module and manufacturing method
US7146106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Jun 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.