Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
US7146720B2 · kind B2 · utility
7Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Mar 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate using the combination pin one indicator and alignment fiducial are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.