Patent · US Expired

Active rinse shield for electrofill chemical bath and method of use

US7146994B2 · kind B2 · utility

1Cited by
13References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 17, 2003
Grant dateDec 12, 2006
Priority date
Expiry dateNov 17, 2024

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S134/902
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

An active rinse shield designed to protect electrofill chemical baths from excessive dilution during rinse sprays on the semiconductor wafer. The shield uses overlapping blades to cover the bath, making a physical barrier between the bath chemistry and the wafer rinse water. The blades are interconnecting ribs that actuate around a common pivot axis. A linear mechanical actuator controls the blade movement, moving the top-most blade, which in turn, moves an adjacent lower blade. Each upper blade is interconnected to an adjacent lower blade by upper and lower ledges, a pivot boss and interlocking cut, and a curved ledge on each blade's body surface. The interconnecting features allow the blades to move one another out for extension or in for retraction. The interlocking blades are inclined above one another, forming grooves to redirect the rinse water away from the chemical bath.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.