Zero insertion force printed circuit assembly connector system and method
US7147499B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Oct 19, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.