CMP composition containing organic nitro compounds
US7148147B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Oct 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic nitro compounds may also be included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.