Integrated circuit and method for manufacturing
US7150516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | Oct 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection device including: a substrate having a first surface having an non-doped region; a first insulative material disposed on a portion of the first surface, the first insulative material having a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantial free of the second insulative material and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the non-doped region on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.