Method of making high speed circuit board
US7152319B2 · kind B2 · utility
5Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Feb 21, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.