Chamber for high-pressure wafer processing and method for making the same
US7153388B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Oct 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Broadly speaking, a wafer processing chamber for performing a high pressure wafer process is provided. More specifically, the wafer processing chamber incorporates a wafer processing volume and an outer chamber volume. The wafer processing volume is configured to contain a high pressure. The outer chamber volume is configured to serve as a buffer between the high pressure of the wafer processing volume and a lower pressure of an environment outside the wafer processing chamber. Thus, the outer chamber volume can control a pressure differential between the high pressure wafer processing volume and the lower pressure outside environment. In this manner, the wafer processing chamber, incorporating the high pressure wafer processing volume, can interface with a conventional wafer transfer module operating under either atmospheric or sub-atmospheric pressure conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.