Inventor · Hercules, CA, US

John Parks

31Patents
6h-index
44Co-inventors
65Inventor score

Filing activity: Nov 2, 1998 → Jun 14, 2013

Most-cited inventions

PatentTitleAreaCited byStatus
US6176198A Apparatus and method for depositing low K dielectric materials Electricity 265 Expired
US6418874B1 Toroidal plasma source for plasma processing Electricity 203 Expired
US7191787B1 Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid Emerging Cross-Sectional Technologies 75 Expired
US6841006B2 Atmospheric substrate processing apparatus for depositing multiple layers on a substrate Emerging Cross-Sectional Technologies 22 Expired
US7389783B2 Proximity meniscus manifold Emerging Cross-Sectional Technologies 18 Expired
US6712020B2 Toroidal plasma source for plasma processing Electricity 7 Expired
US8522799B2 Apparatus and system for cleaning a substrate Performing Operations; Transporting 6 Active
US7648584B2 Method and apparatus for removing contamination from substrate Physics 6 Active
US7350315B2 Edge wheel dry manifold Electricity 5 Expired
US7293571B2 Substrate proximity processing housing and insert for generating a fluid meniscus Emerging Cross-Sectional Technologies 4 Expired
US8328942B2 Wafer heating and temperature control by backside fluid injection Electricity 4 Active
US7758404B1 Apparatus for cleaning edge of substrate and method for using the same Performing Operations; Transporting 3 Active
US7089687B2 Wafer edge wheel with drying function Electricity 3 Expired
US7392815B2 Chamber for wafer cleaning and method for making the same Emerging Cross-Sectional Technologies 3 Expired
US9117860B2 Controlled ambient system for interface engineering Electricity 3 Active
US7591613B2 Method and apparatus for transporting a substrate using non-newtonian fluid Electricity 2 Active
US7416370B2 Method and apparatus for transporting a substrate using non-Newtonian fluid Electricity 2 Expired
US7357115B2 Wafer clamping apparatus and method for operating the same Emerging Cross-Sectional Technologies 2 Expired
US8314027B2 Wafer electroless plating system and associated methods Electricity 1 Active
US8555903B2 Method and apparatus for removing contamination from substrate Physics 1 Active
US8069813B2 Wafer electroless plating system and associated methods Electricity 1 Active
US7153388B2 Chamber for high-pressure wafer processing and method for making the same Emerging Cross-Sectional Technologies 1 Expired
US8485120B2 Method and apparatus for wafer electroless plating Electricity 1 Active
US7604011B2 Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid Emerging Cross-Sectional Technologies 1 Active
US7254900B2 Wafer edge wheel with drying function Electricity 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.