Laser scanning apparatus and methods for thermal processing
US7154066B2 · kind B2 · utility
62Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | May 30, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.