Rewiring substrate strip with a number of semiconductor component positions
US7154116B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jun 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rewiring substrate strip with a number of semiconductor component positions and semiconductor components, which are arranged in rows and columns on the rewiring substrate strip also includes are concealed contact lands arranged in sawing tracks between the semiconductor component positions. The concealed contact lands are connected by rewiring leads both to the external contacts of the product package and to contact areas of the semiconductor chips of the semiconductor components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.