Inventor · Munich, DE

Peter Ossimitz

17Patents

3h-index

16Co-inventors

53Inventor score

Filing activity: Sep 17, 2004 → Feb 1, 2016

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9362187B2	Chip package having terminal pads of different form factors	Electricity	42	Active
US9082644B2	Method of manufacturing and testing a chip package	Electricity	11	Active
US9204543B2	Integrated IC package	Emerging Cross-Sectional Technologies	3	Active
US7640469B2	Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element	Physics	3	Expired
US9859251B2	Semiconductor device having a chip under package	Electricity	2	Active
US7560801B2	Rewiring substrate strip with several semiconductor component positions	Electricity	1	Expired
US8779577B2	Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells	Electricity	1	Active
US9219031B2	Chip arrangement, and method for forming a chip arrangement	Electricity	0	Active
US9651630B2	Circuitry and method for monitoring a power supply of an electronic device	Electricity	0	Active
US9299673B2	Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith	Electricity	0	Active
US7154116B2	Rewiring substrate strip with a number of semiconductor component positions	Electricity	0	Expired
US8399265B2	Device for releasably receiving a semiconductor chip	Electricity	0	Active
US9385059B2	Overmolded substrate-chip arrangement with heat sink	Emerging Cross-Sectional Technologies	0	Active
US9871017B2	Multi-level chip interconnect	Electricity	0	Active
US7501701B2	Rewiring substrate strip having a plurality of semiconductor component positions	Electricity	0	Active
US8799704B2	Semiconductor memory component having a diverting circuit	Physics	0	Active
US10090251B2	Semiconductor chip having a dense arrangement of contact terminals	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.