Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7157646B2 · kind B2 · utility
4Cited by
25References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2004 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Jul 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.