Treatment of effluent from a substrate processing chamber

US7160521B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Peter I. Porshnev · San Jose, US
• Sebastien Raoux · San Francisco, US
• Mike Woolston · San Jose, US
• Christopher L. Aardahl · Sequim, US
• Rick J. Orth · Kennewick, US
• Kenneth G. Rappe · Richland, US

Key dates

• Filing date: Jan 13, 2003
• Grant date: Jan 9, 2007
• Expiry date: Sep 11, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B01D2259/818
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A substrate processing apparatus has a process chamber and an effluent treatment reactor. The process chamber has a substrate support, a process gas supply, a gas energizer, and an exhaust conduit. The effluent treatment reactor has an effluent inlet to receive effluent from the exhaust conduit of the process chamber, a plasma cell having one or more electrodes electrically connected to a voltage source adapted to electrically bias the electrodes to couple energy to effluent received in the plasma cell, a scrubbing cell coaxially exterior to the plasma cell, the scrubbing cell having a scrubbing fluid inlet to introduce scrubbing fluid into effluent in the scrubbing cell and a scrubbing fluid outlet, and an effluent outlet to release the treated effluent.