Chuck for supporting wafers with a fluid
US7160808B2 · kind B2 · utility
8Cited by
28References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Mar 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable platform adapted to direct the flow of chilled, deionized water underneath the device side of the wafer. The chilled water supports the wafer and protects the devices built-up on the wafer from the corrosive effects of KOH and from thermal damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.