Ja-Eung Koo
14Patents
5h-index
45Co-inventors
62Inventor score
Filing activity: Oct 29, 2003 → Mar 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6924207B2 | Method of fabricating a metal-insulator-metal capacitor | Electricity | 10 | Expired |
| US7166019B2 | Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7348277B2 | Methods of fabricating semiconductor device using sacrificial layer | Electricity | 7 | Expired |
| US10032890B2 | Method of manufacturing semiconductor devices | Electricity | 6 | Active |
| US6976902B2 | Chemical mechanical polishing apparatus | Performing Operations; Transporting | 5 | Expired |
| US10056466B2 | Methods for fabricating semiconductor device | Electricity | 2 | Active |
| US10910266B2 | Semiconductor device and method of manufacturing the same | Electricity | 1 | Active |
| US9870950B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US11189572B2 | Maintaining height of alignment key in semiconductor devices | Electricity | 0 | Active |
| US7595253B2 | Method of forming the semiconductor device | Electricity | 0 | Active |
| US11361995B2 | Semiconductor device and method of manufacturing the same | Electricity | 0 | Active |
| US11791173B2 | Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment | Electricity | 0 | Active |
| US11648644B2 | Polishing pad conditioning apparatus | Performing Operations; Transporting | 0 | Active |
| US12426305B2 | Semiconductor device including transistor having source/drain contract with convex curved surface | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.