Chemical mechanical polishing end point detection apparatus and method
US7169016B2 · kind B2 · utility
6Cited by
8References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2006 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Jan 25, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing pad structure that rotates the polishing pad over the surface of the wafer. The apparatus also includes a measuring device which is capable of continuously measuring the surface of the wafer during polishing of the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.