Inventor · Oshima, JP

Takehiko Ueda

26Patents
10h-index
31Co-inventors
75Inventor score

Filing activity: Apr 7, 1976 → Mar 17, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6271047A Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Electricity 147 Expired
US6670200B2 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Electricity 91 Expired
US6489624B1 Apparatus and methods for detecting thickness of a patterned layer Physics 68 Expired
US7052920B2 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same Electricity 56 Expired
US6180472A Method for fabricating semiconductor device Emerging Cross-Sectional Technologies 26 Expired
US6492665B1 Semiconductor device Emerging Cross-Sectional Technologies 18 Expired
US4476219A Silver halide color photographic material Physics 16 Expired
US4141730A Multilayer color photographic materials Physics 15 Expired
US5486993A Controlling apparatus for high frequency high voltage power source for corona discharge processing Emerging Cross-Sectional Technologies 14 Expired
US6963407B2 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program Performing Operations; Transporting 10 Expired
US7169016B2 Chemical mechanical polishing end point detection apparatus and method Performing Operations; Transporting 6 Expired
US4789624A Silver halide color photographic light-sensitive material Physics 5 Expired
US6556179B2 Display device and camera having the display device Physics 4 Expired
US5933181A Photographic recording apparatus Physics 4 Expired
US7686673B2 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium Electricity 3 Expired
US7981309B2 Method for detecting polishing end in CMP polishing device, CMP polishing device, and semiconductor device manufacturing method Electricity 1 Active
US10722264B2 Medical puncture needle and method for manufacturing puncture needle Human Necessities 0 Active
US11033691B2 Medical puncture needle Human Necessities 0 Active
US6051444A Method of manufacture of liquid crystal display device having characteristics which differ locally Physics 0 Expired
US9031687B2 Method for predicting worked shape, method for determining working conditions, working method, working system, semiconductor device manufacturing method, computer program and computer program storage medium Electricity 0 Active
US11517667B2 Puncture needle Human Necessities 0 Active
US10429402B2 Washing/drying apparatus, screening apparatus, washing/drying method, and screening method Physics 0 Active
US12138434B2 Puncture needle and catheter assembly Human Necessities 0 Active
US10682473B2 Medical puncture needle and method for manufacturing puncture needle Performing Operations; Transporting 0 Active
US12158736B2 Electronic apparatus activation control apparatus, electronic apparatus activation control system, electronic apparatus activation control method, and program Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.