Anodization device and anodization method
US7169283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2003 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | May 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be made possible with smaller constituent elements. The electrical contact with the target substrate by a contact member is realized by a plurality of contact members or by the movement of a contact member to change the electrical contact position. The target substrate is manufactured in advance so as to have such a structure that portions thereof to be in contact with the plural contact members are connected to portions of a conductive layer on a treatment part thereof respectively. When the combination of this target substrate and the contact member(s) is used, and the electric current is passed through a part of the contact members, using a changeover switch, or the electric current passed through the contact member is applied to a portion of the conductive layer of the target substrate by the movement of the contact member, it is made possible to reduce the value of the electric current necessary for the treatment to an amount required only for the portion of the treatment part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.