Method and apparatus for cleaning slurry depositions from a water carrier
US7172496B1 · kind B1 · utility
0Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2005 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Aug 17, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.