Device for liquid treatment of wafer-shaped articles
US7172674B2 · kind B2 · utility
9Cited by
22References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6704
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary forces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.