Patent · US Expired

Optical element and method for its manufacture as well as lithography apparatus and method for manufacturing a semiconductor device

US7172788B2 · kind B2 · utility

12Cited by
19References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 2, 2002
Grant dateFeb 6, 2007
Priority date
Expiry dateOct 2, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2495
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

In order to reduce contamination of optical elements which comprise a multilayer system on a substrate, it is proposed that the layer material and/or the layer thickness of at least one layer of the multilayer system are/is selected such that the standing wave which forms during reflection of the irradiated operating wavelength, forms a node of the electrical field intensity (node condition) in the area of the free interface of the multilayer system. Furthermore, a method for determining a design of a multilayer system, as well as a manufacturing process and a lithography apparatus are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.