Power module comprising at least two substrates and method for producing the same
US7176057B2 · kind B2 · utility
2Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Apr 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/148
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module and a method for producing it. The power module has a first substrate having power semiconductor chips, and a second substrate populated with signal semiconductor chips. The substrates are oriented parallel one above the other, their placement sides being arranged facing one another, and the second substrate, with the aid of bonding wires bent in hingelike fashion, being held at a defined distance d from the first substrate and being mechanically fixed in a plastic housing and electrically connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.