Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
US7176131B2 · kind B2 · utility
12Cited by
15References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2004 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Oct 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0235
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.