Substrate cutting device and method
US7182234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Oct 15, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/386
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.