Method for dicing semiconductor wafers
US7183137B2 · kind B2 · utility
64Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Feb 19, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method is disclosed for dicing a wafer having a base material with a diamond structure. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The wafer is then diced through at least one line along a direction at a predetermined offset angle from a natural cleavage direction of the diamond structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.