Lead frame with plated end leads
US7183630B1 · kind B1 · utility
66Cited by
143References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2003 |
| Grant date | Feb 27, 2007 |
| Priority date | — |
| Expiry date | Jun 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.