Method to pattern a substrate
US7186486B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2003 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Jul 15, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70291
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An aspect of the present invention includes a method of lithography to enhance uniformity of critical dimensions of features patterned onto a workpiece. Said workpiece is coated with a coating sensitive to electromagnetic radiation. An electromagnetic radiation source having an illumination intensity is provided. At least one object pixel of electromagnetic radiation is created. A predetermined pattern is exposed, by using said at least one object pixel, on at least a portion of said workpiece in a first exposure pass with a first dose to provide less than full exposure of said coating sensitive to electromagnetic radiation. Said exposing action is repeated at least until said portion of said coating sensitive to electromagnetic radiation is fully exposed, wherein said dose is increased for every following pass. Said fully exposed coating sensitive to electromagnetic radiation is developed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.