Singulation method used in image sensor packaging process and support for use therein
US7186587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | May 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
Abstract
A singulation method used in a process for making a plurality of image sensor packages is disclosed. Firstly, a semi-finished product including a plurality of package structures formed on a substrate is placed on a support having a plurality of cavities for receiving the package structures. Then, the semi-finished product is sawed into separate image sensor packages. During the sawing step, the air pressure in the cavities is decreased to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.