JunYoung Yang
9Patents
3h-index
15Co-inventors
50Inventor score
Filing activity: Aug 11, 2004 → Feb 8, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7087461B2 | Process and lead frame for making leadless semiconductor packages | Electricity | 48 | Expired |
| US7327015B2 | Semiconductor device package | Electricity | 44 | Expired |
| US7169651B2 | Process and lead frame for making leadless semiconductor packages | Electricity | 13 | Expired |
| US12095514B2 | Electronic apparatus including antenna and audio interface | Electricity | 0 | Active |
| US7186587B2 | Singulation method used in image sensor packaging process and support for use therein | Electricity | 0 | Expired |
| US10679929B2 | Semiconductor package device and method of manufacturing the same | Electricity | 0 | Active |
| US11404358B2 | Semiconductor package device and method of manufacturing the same | Electricity | 0 | Active |
| US12224479B2 | Electronic device comprising an antenna and microphone | Electricity | 0 | Active |
| US12166272B2 | Electronic device comprising antenna and segmentation part | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.