Thermal interface material and solder preforms
US7187083B2 · kind B2 · utility
17Cited by
38References
74Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Aug 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.