Systems and methods that employ exposure compensation to provide uniform CD control on reticle during fabrication
US7187796B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2003 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Dec 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/78
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention relates to monitoring and controlling a reticle fabrication process (e.g. employed with an electron beam lithography process). A typical fabrication process involves discrete stages including exposure, post-exposure bake and development. After fabrication is complete, an inspection can be performed on the reticle to determine whether any parameters during fabrication and/or any data points are outside of acceptable tolerances. The data is collected and fed into an algorithm (e.g. data-mining algorithm) utilized to determine which fabrication parameters need to be modified then sends the data to a control system (e.g. advanced process control) to facilitate needed changes to the fabrication parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.