Bottom heat spreader
US7190068B2 · kind B2 · utility
12Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | Mar 13, 2007 |
| Priority date | — |
| Expiry date | Jun 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.