Arrangement for determining a temperature loading of an integrated circuit and method

US7198403B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Manfred Proll · Dorfen, DE
• Jürgen Auge · Unterhaching, DE
• Stephan Schröder · Birkenfeld, DE
• Thomas Huber · Schliersee, DE

Key dates

• Filing date: Dec 10, 2004
• Grant date: Apr 3, 2007
• Expiry date: Apr 1, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip (1) comprises at least one contact (2) to be soldered or is electrically conductively connected to at least one contact (14d) to be soldered that is situated outside the semiconductor chip. The semiconductor chip (1) furthermore comprises a temperature sensor device (3), which determines a measurement quantity corresponding to the temperature. A processing device (4, 5) has an analog-to-digital converter (5), which is electrically conductively connected to the temperature sensor device (3) and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (10), which is electrically conductively connected to the temperature sensor device (3) and the processing device (4, 5), supplies these components with an operating voltage. A data memory (6) serves for storing the at least one storable signal. An electrical line (7, 11) connected to the data memory (6) serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of inf…