Semiconductor device having stacked semiconductor chips sealed with a resin seal member
US7199469B2 · kind B2 · utility
6Cited by
23References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Apr 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.