Methods of forming a plurality of capacitors
US7202127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Sep 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
Abstract
A plurality of capacitor electrode openings is formed within capacitor electrode-forming material. A first set of the openings is formed to a depth which is greater within the capacitor electrode-forming material than is a second set of the openings. Conductive first capacitor electrode material is formed therein. A sacrificial retaining structure is formed elevationally over both the first capacitor electrode material and the capacitor electrode-forming material, leaving some of the capacitor electrode-forming material exposed. With the retaining structure in place, at least some of the capacitor electrode-forming material is etched from the substrate effective to expose outer sidewall surfaces of the first capacitor electrode material. Then, the sacrificial retaining structure is removed from the substrate, and then capacitor dielectric material and conductive second capacitor electrode material are formed over the outer sidewall surfaces of the first capacitor electrode material formed within the first and second sets of capacitor openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.