Method for forming, under a thin layer of a first material, portions of another material and/or empty areas
US7202153B2 · kind B2 · utility
4Cited by
14References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 9, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Aug 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.