Impedane measurement of chip, package, and board power supply system using pseudo impulse response
US7203608B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Jun 16, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3008
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring impedance of a microprocessor chip, electronic packaging, and circuit board power supply system by generating a pseudo-impulse current having a width size in the time domain not larger than the inversion of a maximum frequency of interest and obtaining a voltage measurement in a frequency domain of the pseudo-impulse current. The mechanism of the present invention then predicts the normalized Fourier transformation of the current in the frequency domain, wherein the normalized Fourier transformation depends upon a switching charge of the pseudo-impulse current, measures the switching charge of the pseudo-impulse current, obtains a first current measurement at zero frequency using the measured switching charge, and obtains a second current measurement at a frequency of interest using the first current measurement. The mechanism of the present invention then calculates the impedance of the chip/package/board power supply system using the voltage measurement and the second current measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.